The MegaPhase High-Density Interconnect product line offers a large variety of connector configurations to system designers to optimize packaging miniaturization while maintaining electrical and mechanical robustness. When light weight, higher density and performance are critical to the application, MegaPhase’s line of High-Density Interconnects and High-Density Packages is the answer. Solutions are based on snap-in interfaces, SMP, SMPM and SMPS per MIL-STD-348B. We offer printed circuit board mount (edge, surface and through mount), coax cable connectors, adapters, hermetics, and multiports.Coaxial-to-PCB transition simulation service is provided at no additional cost. Our customers provide the PCB stack up (layered thickness, materials, and transmission waveguide type) and, upon completion, our customers receive the connector transition in DXF format.